Industry Partners & Liaisons

Seamless and secure payments are built on global standards and specifications. EMVCo has been flexible updating specifications in order to meet regulatory and technical changes. We are confident that EMVCo will continue to deliver specifications for any future payments needs.

For more than 20 years APSCA has collaborated with EMVCo to educate stakeholders across Asia-Pacific on the benefits of using EMV Specifications as a foundation for seamless and secure payments. These efforts have been key to driving EMV Chip migration in the region, and supporting the continued growth of contactless, mobile NFC, QR Codes and digital payments.

When W3C began to focus on streamlining e-commerce checkout, EMVCo and W3C recognised the value of developing an industry partnership. With the FIDO Alliance we then established a dedicated Web Payment Security Interest Group. All three organisations now work more closely to improve online payment security and to enhance interoperability among our respective technologies. Through this collaboration we anticipate that merchants, payment service providers, and other industry stakeholders will benefit from more secure and streamlined online payments.

This [Use of FIDO Data in 3DS Messages] paper, as well as FIDO Alliance’s complementary technical note, provides essential information on how FIDO can be used alongside EMV 3DS to provide higher levels of security, enhanced user experiences, and better overall approval rates for e-commerce merchants. These papers are part of our longstanding relationship with EMVCo and our shared focus on providing answers to the questions we often receive on how our FIDO Alliance standards and EMVCo specifications can work together.

The U.S. Payments Forum has worked closely with EMVCo over the years in our efforts to support the introduction and implementation of EMV chip and other new and emerging technologies that protect the security of, and enhance opportunities for, payment transactions within the U.S.