EMVCo has published ‘2018: A Year in Review’ - reflecting on achievements from the past twelve months and looking forward to priorities for the year ahead. The report also offers further insight into the EMVCo Associates Programme, an overview of key EMV® technologies and the latest worldwide EMV® Chip deployment statistics.
EMV® Chip Specifications describe the requirements for global interoperability between chip-based payment applications and acceptance terminals to enable secure contact, contactless and mobile transactions and other emerging payment technologies (such as QR Code-based payments).Find out more
EMVCo has published the EMV® 3-D Secure Protocol and Core Functions Specification v2.0.0, which provides a globally interoperable framework that promotes a consistent consumer experience across all e-commerce channels and connected devices when verifying a cardholder.Find out more
If you are a journalist and have a media inquiry, please contact EMVCo’s PR agency detailed below. If you are not a journalist and have a question related to EMVCo technology, please submit your query through the Contact Us page.
Tel: +44 (0)113 350 1922
If you are not a journalist and have a question related to EMVCo technology, please submit your query through the public comments page.
To receive email notifications when news or new documents-draft or final Specification Bulletins, press releases, or other-are posted to the EMVCo website, sign up for our public mailing list using the form below.