EMVCo is a global technical body that facilitates worldwide interoperability and acceptance of secure payment transactions by managing and evolving the EMV® Specifications and related testing processes.
EMVCo publishes global transaction volume data twice a year which showcases the number of contact and contactless card-present payments using EMV® chip technology during a 12 month period.
There are three elements to EMVCo’s structure: industry participation to get input from market participants, technical groups driven by market experts, and the strategic and operation structure to support technical outputs that meet market requirements.
EMVCo has published ‘2018: A Year in Review’ - reflecting on achievements from the past twelve months and looking forward to priorities for the year ahead. The report also offers further insight into the EMVCo Associates Programme, an overview of key EMV® technologies and the latest worldwide EMV® Chip deployment statistics.
EMV® Chip Specifications describe the requirements for global interoperability between chip-based payment applications and acceptance terminals to enable secure contact, contactless and mobile transactions and other emerging payment technologies (such as QR Code-based payments).
Find out moreEMVCo has published the EMV® 3-D Secure Protocol and Core Functions Specification v2.0.0, which provides a globally interoperable framework that promotes a consistent consumer experience across all e-commerce channels and connected devices when verifying a cardholder.
Find out more
If you are a journalist and have a media inquiry, please contact EMVCo’s PR agency detailed below. If you are not a journalist and have a question related to EMVCo technology, please submit your query through the Contact Us page.
iseepr – media@emvco.com, EMVCo@iseepr.co.uk
Tel: +44 (0)113 350 1922
If you are not a journalist and have a question related to EMVCo technology, please submit your query through the public comments page.
To receive email notifications when news or new documents-draft or final Specification Bulletins, press releases, or other-are posted to the EMVCo website, sign up for our public mailing list using the form below.
