"Chip & Platform",Company,Location,"Product Name","Approval Number","Expiration Date",PDF
"Approved Sites","Hengbao Co. Ltd.","People's Republic of China",Beijing,SALN0001,07/06/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0001_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd","PR China","Huawei D3 Building",SALN0002,28/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0002_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd","PR China","Huawei D1 Data Center",SALN0003,27/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0003_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd","PR China","Huawei, Building U1",SALN0004,21/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0004_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd","PR China","Huawei No. 127",SALN0005,24/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0005_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd","PR China","Huawei Shanghai DongFangWanGao",SALN0006,17/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0006_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd (TSMC site)","PR China","TSMC Fab 15B",SALN0007,08/06/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0007_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd (ASEKH site)","PR China","ASEKH K7 building",SALN0008,08/06/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0008_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd","PR China","Huawei Shanghai Base",SALN0009,18/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0009_N_09_2018.pdf
"Approved Sites","HiSilicon Technologies Co., Ltd (ASEKH site)","PR China","ASEKH K11 building",SALN0010,08/06/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0010_N_09_2018.pdf
"Approved Sites","Shanghai Fudan Microelectronics Group Co., Ltd.","People's Republic of China","Shanghai HQ-B2",SALN0011,09/04/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0011_N_09_2018.pdf
"Approved Sites","XH Smart Tech (China) Co., Ltd.","People's Republic of China","XH Smart Zhuhai",SALN0014,06/09/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0014_N_12_2018.pdf
"Platform Products",IDEMIA,France,"Cosmo Fly",PCN0150,21/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0150_R_09_2020.pdf
"Platform Products",IDEMIA,France,"Cosmo Fly",PCN0150.01,21/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0150.01_R_09_2020.pdf
"Platform Products",IDEMIA,France,"Cosmo Fly",PCN0150.02,21/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0150.02_R_09_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 4",PCN0160,14/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0160_R_12_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,SPM71,PCN0161,14/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0161_R_12_2020.pdf
"IC Products","STMicroelectronics (Rousset) SAS",France,ST33J2M0,ICCN0229,08/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0229_R_09_2020.pdf
"IC Products","Infineon Technologies AG",Germany,IFX_ECI_Fh[1h-4h],ICCN0237,09/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0237_R_12_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 3 EMV",PCN0113.03,13/10/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0113.03_R_10_2020.pdf
"Approved Sites","G&D México",Germany,"Giesecke y Devrient de México, S.A. de C.V.",SALN0017,27/11/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0017_N_03_2019.pdf
"Approved Sites","Alioth LLC",Russia,"Alioth LLC, Sof’ino village – factory",SALN0015,10/09/2023,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0015_N_01_2019.pdf
"Approved Sites","Redsys Servicios de Procesamiento S.L.",Spain,"Redsys Servicios de Procesamiento S.L.",SALN0018,10/04/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0018_N_05_2019.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3NSEN4,ICCN0262,18/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0262_R_04_2021.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 3 SECID",PCN0148,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0148_R_05_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 3 P60",PCN0148.01,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0148.01_R_05_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,"SN200 Series",ICCN0264,14/05/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0264_R_04_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 4",PCN0160.01,14/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0160.01_R_12_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,SPM71,PCN0161.01,14/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0161.01_R_12_2020.pdf
"Approved Sites","Chutian Dragon Co., Ltd",China,"Chutian Dragon Development site",SALN0020,27/03/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0020_N_07_2019.pdf
"Approved Sites","UBIVELOX Inc.",Korea,"UBIVELOX Inc. R&D center",SALN0022,09/07/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0022_N_09_2019.pdf
"Platform Products","Toshiba Infrastructure Systems & Solutions Corp.",Japan,"Profinia F404",PCN0170,09/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0170_R_06_2020.pdf
"Approved Sites","Precise Biometrics AB",Sweden,"Precise Biometrics AB",SALN0023,19/06/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0023_N_10_2019.pdf
"IC Products","STMicroelectronics (Rousset) SAS",France,ST31H320,ICCN0215,13/07/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0215_R_08_2020.pdf
"Platform Products",IDEMIA,France,"Cosmo RSA",PCN0147.01,10/07/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0147.01_R_08_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,"SN100 Series",ICCN0254,25/05/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0254_R_05_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 3 SECID",PCN0148.02,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0148.02_R_05_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 3 P60",PCN0148.03,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0148.03_R_05_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,N7121,ICCN0258,22/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0258_R_11_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,N7121,ICCN0259,22/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0259_R_11_2020.pdf
"IC Products","STMicroelectronics (Rousset) SAS",France,"ST54J / ST54K",ICCN0260,30/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0260_R_12_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3NSN4V,ICCN0269,07/04/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0269_R_04_2021.pdf
"Approved Sites","IDEX Biometrics UK Ltd",NORWAY,"IDEX Biometrics UK Ltd",SALN0024,18/12/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0024_N_01_2020.pdf
"Platform Products","Giesecke+Devrient Mobile Security GmbH",Germany,"Sm@rtcafé Expert 7.0 Wearables Edition",PCN0174,22/03/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0174_R_03_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,"P6021y (y=P,M,D,J)",ICCN0218,21/05/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0218_R_02_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,"P6022y y=P,X,M,D,J",ICCN0223,29/03/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0223_R_03_2021.pdf
"Platform Products","Giesecke+Devrient Mobile Security GmbH",Germany,"Sm@rtcafé Expert 7.0 Wearables Edition Passive TPHM",PCN0174.01,22/03/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0174.01_R_03_2020.pdf
"IC Products","Thales DIS Design Services SAS",France,PEGASUS_CB_05,ICCN0270,16/01/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0270_R_03_2021.pdf
"IC Products","Infineon Technologies AG",Germany,IFX_ECI_2Fh[9h-Ch],ICCN0271,03/04/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0271_R_04_2021.pdf
"Approved Sites","Wuhan Tianyu Information Industry Co. Ltd","People's Republic of China","Wuhan City - Production",SALN0028,28/11/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0028_N_04_2020.pdf
"Approved Sites","Wuhan Tianyu Information Industry Co. Ltd","People's Republic of China","Wuhan City - Development",SALN0029,27/11/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0029_N_04_2020.pdf
"Approved Sites","Giesecke & Devrient Development Center India (DCI)",Germany,Pune,SALN0027,14/04/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0027_N_04_2020.pdf
"Approved Sites","Giesecke+Devrient Mobile Security Iberia S.A., Barcelona",Germany,"Giesecke+Devrient Mobile Security Iberia S.A, Barcelona site",SALN0030,09/04/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0030_N_05_2020.pdf
"Platform Products","Giesecke+Devrient Mobile Security GmbH",Germany,"Sm@rtSIM CX Copernicus 2020",PCN0164.01,10/05/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0164.01_N_05_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 5.2",PCN0156.09,19/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0156.09_N_06_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 5.2",PCN0156.10,19/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0156.10_N_06_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3FV9RR,ICCN0224,07/04/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0224_R_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID X SLJ 52G",PCN0178,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0178_N_07_2020.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID X SLJ 52G",PCN0178.01,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0178.01_N_07_2020.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID X SLJ 52G",PCN0178.02,02/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0178.02_N_07_2020.pdf
"Approved Sites","Yagoba GmbH",Austria,"Main Office",SALN0031,18/06/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0031_N_07_2020.pdf
"Platform Products","Thales DIS France SA",France,"Combo CE 4.2.3",PCN0179,07/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0179_N_08_2020.pdf
"IC Products","Infineon Technologies AG",Germany,M5073,ICCN0217,18/05/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0217_R_08_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,P73N2M0,ICCN0234,29/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0234_R_08_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,P73N2M0,ICCN0245,29/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0245_R_08_2020.pdf
"IC Products","NXP Semiconductors Germany GmbH",Germany,P73N2M0,ICCN0251,29/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0251_R_08_2020.pdf
"IC Products","STMicroelectronics (Rousset) SAS",France,ST31P450,ICCN0267,06/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0267_R_08_2020.pdf
"IC Products","Thales DIS Design Services SAS",France,CENTAURUS_FB_04,ICCN0246,17/07/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0246_R_08_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3FT9MH,ICCN0216,02/07/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0216_R_09_2020.pdf
"Platform Products",IDEMIA,France,"Cosmo RSA",PCN0147,10/07/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0147_R_08_2020.pdf
"Platform Products",IDEMIA,France,"Cosmo RSA",PCN0147.02,10/07/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0147.02_R_08_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 4.0",PCN0136,29/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0136_R_09_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 4.1",PCN0136.03,29/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0136.03_R_09_2020.pdf
"Approved Sites","Giesecke+Devrient Mobile Security GmbH",Germany,"Giesecke+Devrient Mobile Security Development Center Germany (DCG)",SALN0032,17/06/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0032_N_09_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3K250A,ICCN0235,28/10/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0235_R_10_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3K170A,ICCN0240,28/10/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0240_R_10_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3D350A,ICCN0244,28/10/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0244_R_10_2020.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3K200B,ICCN0268,12/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0268_R_10_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 5.2",PCN0156.12,19/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0156.12_N_10_2020.pdf
"IC Products","Shanghai Fudan Microelectronics Group Co., Ltd.","People's Republic of China",FM1280,ICCN0275,15/10/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0275_N_11_2020.pdf
"IC Products","Idemia Starchip",France,SCB256i,ICCN0236,06/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0236_R_12_2020.pdf
"Platform Products","Thales DIS France SA",France,TESS,PCN0182,29/05/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0182_N_12_2020.pdf
"IC Products","Idemia Starchip",France,SCR496U,ICCN0276,24/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0276_N_12_2020.pdf
"Platform Products","Giesecke+Devrient Mobile Security GmbH",Germany,"Sm@rtSIM CX Aries",PCN0153.01,22/12/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0153.01_R_12_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 5.1",PCN0156.06,19/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0156.06_R_05_2020.pdf
"Platform Products","NXP Semiconductors Germany GmbH",Germany,"JCOP 5.2",PCN0156.07,19/06/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0156.07_R_05_2020.pdf
"Platform Products","Thales DIS France SA",France,"Contactless R11",PCN0183,28/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0183_N_01_2021.pdf
"Approved Sites","Datang Microelectronics Technology Co. Ltd","P.R. China","Datang Microelectronics Technology Co. Ltd",SALN0033,06/08/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0033_N_01_2021.pdf
"Approved Sites","Datang Microelectronics Technology Co. Ltd (SMIC Shanghai site)","P.R. China","Semiconductor Manufacturing International Corporation",SALN0034,06/07/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0034_N_01_2021.pdf
"Approved Sites","Datang Microelectronics Technology Co. Ltd (SMIC Beijing site)","P.R. China","Semiconductor Manufacturing International Corporation",SALN0035,04/08/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0035_N_01_2021.pdf
"IC Products","Infineon Technologies AG",Germany,M5074,ICCN0220,22/01/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0220_R_01_2021.pdf
"IC Products","Infineon Technologies AG",Germany,IFX_ECI_22h[1h-1Eh],ICCN0257,10/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0257_R_01_2021.pdf
"Approved Sites","Goldpac Tech Park - Zhuhai","People's Republic of China","Goldpac Tech Park",SALN0036,23/09/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0036_N_01_2021.pdf
"Platform Products","STMicroelectronics (Rousset) SAS",France,"STPAY Topaz-1",PCN0171,28/11/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0171_R_02_2021.pdf
"Platform Products","UBIVELOX Inc.",Korea,"Ucard NFC",PCN0184,05/02/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0184_N_02_2021.pdf
"Approved Sites","Fingerprint Cards AB Göteborg",SWEDEN,"Fingerprint Cards AB Göteborg",SALN0037,01/10/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0037_N_02_2021.pdf
"Approved Sites","Fingerprint Cards AB Copenhagen",SWEDEN,"Fingerprint Cards AB Copenhagen",SALN0038,20/11/2024,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0038_N_02_2021.pdf
"IC Products","CEC Huada Electronic Design Co., Ltd.",China,CIU9872B_01,ICCN0272,12/03/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0272_R_02_2021.pdf
"IC Products","Tongxin Microelectronics Co., Ltd.","People's Republic of China",THD89,ICCN0252,05/03/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0252_R_03_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ Pay SLJ 32P",PCN0143.02,03/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0143.02_R_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ Pay SLJ 32P",PCN0143.03,03/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0143.03_R_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ Pay SLJ 32P",PCN0143.04,03/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0143.04_R_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ Pay SLJ 32P",PCN0143.05,03/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0143.05_R_04_2021.pdf
"Platform Products","Thales DIS France SA",France,"Contactless R12",PCN0185,15/01/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0185_N_04_2021.pdf
"Approved Sites","Beijing Watchdata Co., Ltd., Production Site",China,"Beijing Watchdata Co., Ltd., Production Site",SALN0039,07/01/2026,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCO_SALN0039_N_04_2021.pdf
"Approved Sites","Beijing Watchdata Co., Ltd., Development Site",China,"Beijing Watchdata Co., Ltd., Development Site",SALN0040,08/01/2026,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0040_N_04_2021.pdf
"IC Products","Infineon Technologies AG",Germany,IFX_ECI_53h[01h-1Eh],ICCN0274,03/04/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0274_N_07_2020.pdf
"Approved Sites","UBIVELOX Inc.",Korea,"UBIVELOX Inc. Production Facility",SALN0041,05/03/2026,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0041_N_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID S SLJ 52G 2kRSA",PCN0173.06,04/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0173.06_N_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID S SLJ 52G 4kRSA",PCN0173.07,04/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0173.07_N_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID S SLJ 52G 2kRSA",PCN0173.08,04/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0173.08_N_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID S SLJ 52G 4kRSA",PCN0173.09,04/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0173.09_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID S SLJ 52G 2kRSA",PCN0173.10,04/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0173.10_N_04_2021.pdf
"Platform Products","Infineon Technologies AG",Germany,"SECORA™ ID S SLJ 52G 4kRSA",PCN0173.11,04/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0173.11_N_04_2021.pdf
"Platform Products","Thales DIS France SA",France,FXR5,PCN0186,22/01/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0186_N_04_2021.pdf
"IC Products","Datang Microelectronics Technology Co., Ltd.","P.R. China",DMT-CBS-CE3D,ICCN0277,07/09/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0277_N_04_2021.pdf
"IC Products","Samsung Electronics Co., Ltd.","Korea (Republic of)",S3D384C,ICCN0273,22/06/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0273_R_04_2021.pdf
"Approved Sites","Goldpac Limited","People's Republic of China","Goldpac R&D Center – Development",SALN0042,20/11/2025,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_SALN0042_N_04_2021.pdf
"Platform Products","Thales DIS France SA",France,"UpTeq NFC 4.2.2",PCN0168,29/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0168_R_05_2021.pdf
"Platform Products","Thales DIS France SA",France,"UpTeq NFC 4.2.2",PCN0168.01,29/05/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0168.01_N_05_2021.pdf
"Platform Products","Thales DIS France SA",France,"Combo CE 4.2.3",PCN0179.01,07/08/2021,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_PCN0179.01_N_05_2021.pdf
"IC Products","Infineon Technologies AG",Germany,IFX_ECI_18h[1h],ICCN0241,30/01/2022,https://www.emvco.com/wp-content/uploads/approved_products/uploaded/loa_se/EMVCo_ICCN0241_R_04_2021.pdf